Monolithic Integration of RF MEMS Switches With a Diversity Antenna on PCB Substrate

نویسندگان

  • B. A. Cetiner
  • J. Y. Qian
  • H. P. Chang
  • M. Bachman
  • G. P. Li
  • F. De Flaviis
چکیده

A novel process for monolithic integration of RF MEMS switches with three-dimensional (3-D) antenna elements on a microwave laminate printed circuit board (PCB) is presented. This process calls for a low temperature (90-170C) high-density inductively coupled plasma chemical vapor deposition (HDICP CVD) technique that allows the choice of any PCB substrate, such as RO4003-FR4 (εr=3.38, tanδ=0.002), with the desired electrical properties for antenna applications. A twoelement diversity antenna system monolithically integrated with RF MEMS switches is designed and demonstrated.

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تاریخ انتشار 2002